IC wire bond / lead frame automatic inspection device LFX-1000
Automatic inspection of IC wire bonds and lead frame conditions! Inline X-ray inspection equipment.
The "LFX-1000" is an inline X-ray inspection device capable of fully automated inspection using a reflective type. It inspects the state of wire bonds and lead frames inside ICs with high speed and high precision. In addition, we also handle the transmission type "LFX-2000," as well as the reflective type automatic inspection device for reel-compatible IC wire bonds, "LFX-1000R," and the transmission type "LFX-2000R." 【Features】 ■ Automatically transports and inspects in the state of the lead frame, marking defective areas. ■ Capable of inspecting not only wire bonds but also metal foreign objects and lead frame pitch. ■ Lead frames can be set directly in the loader section or supplied via a magazine rack. *For more details, please refer to the PDF document or feel free to contact us.
- Company：アイビット
- Price：Other
